Description
Amaoe U-SMG5 Stencil for IC Reballing & Mobile Repair
The Amaoe U-SMG5 Stencil is used for IC reballing and mobile motherboard repair. It has a 0.12mm body made from high-grade stainless steel with heat-resistant properties. The BGA openings help technicians place solder balls correctly during IC reballing. This stencil supports Exynos 2200, E9925, Exynos 2100, Exynos 990, RAM496, MAX77705C, MAX77705F, SM3080, S5200A, S5311, SPS25, SPS26, Shannon-A5123, Shannon-5510, S5520, W9020, OPM5825, SMR526, BGA153, TN2145 and other listed chipsets. Its compact size makes it easy to use during regular repair work. Clean the stencil after use and store it flat. Get the U-SMG5 Stencil from Stmobileparts.com for accurate IC reballing and mobile motherboard repair work
FAQs
What does the U-SMG5 Stencil do?
It helps technicians place solder balls accurately when they reball compatible ICs.
Which ICs can I use with this stencil?
It supports the Exynos, RAM, PMIC, Shannon, SM, and other chipsets listed above.
Is the U-SMG5 stencil heat-resistant?
Yes. The stencil uses a high-grade stainless steel with heat-resistant properties.
What is the stencil thickness?
The Amaoe U-SMG5 has a 0.12mm thickness.
