Description
MaAnt Qualcomm CPU-A Reballing Stencil for Snapdragon CPU Repair
The MaAnt Qualcomm CPU-A Reballing Stencil is a professional CPU BGA reballing tool designed for compatible Qualcomm Snapdragon processors and smartphone motherboard repair applications.
It features multiple CPU layouts for Snapdragon 8 Gen 1, Snapdragon 888, Snapdragon 778G, Snapdragon 855, Snapdragon 865 and Snapdragon 765G processor servicing.
Why Choose This Stencil?
The MaAnt Qualcomm CPU-A Reballing Stencil combines multiple Qualcomm CPU reballing patterns in one convenient repair tool.
Its precision BGA openings help technicians position solder balls during compatible processor rework and chip-level smartphone motherboard servicing.
Supported CPU Layouts: SM8450, SM8350, SM7325, SM8150, SM8250, SM8250-002, SM7250 and SM7350.
Compatible Snapdragon Processors
The MaAnt Qualcomm CPU-A Reballing Stencil includes layout references for Snapdragon 8 Gen 1, 888, 778G, 855, 865, 765G and SM7350 processor applications.
Exact chipset markings and BGA patterns must match before use.
Professional CPU Reballing Applications
The MaAnt Qualcomm CPU-A Reballing Stencil is useful for compatible Qualcomm CPU servicing, solder ball rework and professional mobile motherboard repair.
Buy from ST Mobile Parts
Shop the premium MaAnt Qualcomm CPU-A Reballing Stencil at ST Mobile Parts, Karachi, Pakistan, for professional Snapdragon CPU repair tools and BGA reballing accessories.
Note: Always verify the CPU number, chip dimensions and physical BGA layout before use.
FAQs
Does the MaAnt Qualcomm CPU-A Reballing Stencil support Snapdragon 888?
Yes, the SM8350 layout is listed.
Does it support Snapdragon 8 Gen 1?
Yes, SM8450 is included.
Does it support SM8250 and SM8250-002?
Yes, both markings are listed.
Can it be used for Snapdragon 778G?
Yes, the SM7325 layout is listed.
Does it support SM7350?
Yes, SM7350 is included among the layout markings.
Will it work with every Qualcomm phone?
No, the exact processor package and BGA pattern must match.
