Description
MaAnt Huawei CPU-A Reballing Stencil for HiSilicon Kirin CPU Repair
The MaAnt Huawei CPU-A Reballing Stencil is a professional 0.12MM BGA stencil for compatible Huawei HiSilicon Kirin CPU reballing and smartphone motherboard repair applications.
It is offered with multiple processor layout references for Kirin CPU servicing, solder ball positioning and professional chip-level electronics rework.
Why Choose This Stencil?
The MaAnt Huawei CPU-A Reballing Stencil brings multiple Huawei processor layout references together in one convenient repair accessory.
Its 0.12MM thickness and precision BGA patterns make it useful for compatible CPU solder ball rework and professional mobile repair applications.
Compatible CPU Markings: HI3630, HI6620, HI6290/L, HI6280, HI6260, HI6250 and HI6220.
Supported HiSilicon Kirin Processors
The MaAnt Huawei CPU-A Reballing Stencil is offered for Kirin 920, Kirin 910/910T, Kirin 820, Kirin 810, Kirin 710, Kirin 659 and Kirin 620 processor applications.
These compatibility references must be checked against the original stencil because individual processor packages may have different BGA arrangements.
Professional CPU Reballing Applications
The MaAnt Huawei CPU-A Reballing Stencil is intended for compatible Huawei CPU repair, smartphone motherboard servicing and BGA solder ball rework.
Technicians should select the correct stencil pattern according to the original processor number and chip dimensions.
Buy from ST Mobile Parts
Shop the premium MaAnt Huawei CPU-A Reballing Stencil at ST Mobile Parts, Karachi, Pakistan, for professional Huawei CPU repair tools and BGA reballing accessories.
Note: Always verify the exact Kirin CPU marking, physical BGA pattern and processor package dimensions before use. The complete MaAnt-specific compatibility list requires confirmation.
FAQs
Does the MaAnt Huawei CPU-A Reballing Stencil support Kirin 820?
HI6290/L is included in the supplied compatibility references.
Does it support Kirin 810 and Kirin 710?
Yes, HI6280 and HI6260 are the corresponding processor references.
Can I use it for Kirin 659 and Kirin 620?
HI6250 and HI6220 are included in the supplied compatibility list.
Does it support Kirin 920 and Kirin 910?
HI3630 and HI6620 are listed references. HI6620 is commonly associated with Kirin 910T.
What is the stencil thickness?
The stated thickness is 0.12MM.
Will it work with every Huawei phone?
No, the exact CPU number, chip dimensions and BGA layout must match.
