Description
AMAOE U-UNI1 BGA Reballing Stencil for UNISOC CPU & IC Repair | Premium Quality
The AMAOE U-UNI1 BGA Reballing Stencil is a professional 0.12MM multi-layout stencil designed for compatible UNISOC processors and supporting IC packages. It is intended for CPU reballing, BGA solder ball rework and smartphone motherboard servicing.
The stencil includes listed CPU layouts for UMS512T, UMS9230H, UIS8910 and R818, along with multiple supporting IC and BGA patterns. It helps technicians identify appropriate reballing layouts using exact component markings.
This multi-layout stencil is useful for professional mobile repair technicians handling compatible UNISOC CPU packages, IC servicing and chip-level electronics repair.
Why Choose This Stencil?
The AMAOE U-UNI1 BGA Reballing Stencil combines multiple UNISOC processor and supporting IC reballing patterns in one convenient repair accessory.
Its 0.12MM thickness is specified for compatible BGA solder ball applications, helping technicians select the appropriate stencil during processor and IC servicing.
The multi-layout design reduces the need for separate stencils when working with different supported chip patterns.
With dedicated markings for multiple UNISOC CPU packages and supporting components, the AMAOE U-UNI1 BGA Reballing Stencil provides a practical solution for professional smartphone motherboard repair.
Compatible UNISOC CPU Markings
UMS512T: Listed UNISOC processor BGA reballing layout.
UMS9230H: Compatible processor reballing pattern.
UIS8910: Listed processor BGA layout.
R818: Supported processor reballing marking.
Additional Supported IC Markings
The AMAOE U-UNI1 stencil is listed with the following supporting IC markings:
UMW2651, UMW2652, UMP510G, UWP51065, UIP8910, SGM41512, SR3595D, RR88643-21, RPM6743-31 and RR88916.
These markings help technicians identify matching IC patterns during compatible BGA rework.
Additional BGA Layout References
2233, BGA221, BGA153, BGA254 and BGA200.
These are printed layout references. Exact solder ball patterns and chip dimensions must match before use.
Professional Repair Applications
The AMAOE U-UNI1 BGA Reballing Stencil is intended for compatible UNISOC CPU reballing, supporting IC servicing and professional smartphone motherboard repair.
Technicians can select relevant BGA layouts by comparing the IC marking and physical chip package with the stencil pattern.
It is designed for component-level BGA rework rather than motherboard middle-layer reballing.
Buy from ST Mobile Parts
Shop the AMAOE U-UNI1 BGA Reballing Stencil at ST Mobile Parts for professional UNISOC CPU repair tools, supporting IC reballing accessories and mobile motherboard servicing equipment.
The stencil provides multiple chip layouts in one product for compatible processor and IC servicing applications.
Note: Verify the exact IC number, package dimensions, BGA ball count and stencil layout before purchasing or use. Supplier listings show UMP510G and UWP51065; the alternative markings UMP510C and UMP51065 require confirmation from the original stencil.
FAQs
What is the AMAOE U-UNI1 BGA Reballing Stencil used for?
It is designed for compatible UNISOC CPU and supporting IC reballing during smartphone motherboard servicing.
What is the stencil thickness?
The specified thickness is 0.12MM.
Which main UNISOC processors are supported?
The listed processor markings include UMS512T, UMS9230H, UIS8910 and R818.
Which additional IC and BGA layouts are included?
The stencil includes UMW2651, UMW2652, UIP8910, SGM41512, BGA221, BGA153, BGA254, BGA200 and other listed patterns.
Is this stencil compatible with every UNISOC smartphone?
No. Compatibility depends on the exact processor or IC package dimensions and matching BGA solder ball layout.
