Description
AMAOE U-MTU5 BGA Reballing Stencil for MediaTek Dimensity CPU & RAM | Premium Quality
The AMAOE U-MTU5 BGA Reballing Stencil is a professional 0.12MM multi-layout stencil designed for compatible MediaTek Dimensity CPU and RAM reballing applications. Featuring dedicated BGA patterns for multiple Dimensity processors, this stencil is intended for smartphone motherboard repair, processor servicing, memory chip rework and professional electronics maintenance.
The stencil includes seven listed MediaTek CPU layouts covering Dimensity 9400, 9300, 9200, 6100+, 8300 Ultra, 7300X and 7200 Ultra, along with a dedicated RAM496 memory reballing pattern.
This multi-layout stencil provides a practical repair solution for technicians working with compatible MediaTek-powered Android smartphone processors and memory packages.
Why Choose This Stencil?
The AMAOE U-MTU5 BGA Reballing Stencil combines multiple MediaTek Dimensity CPU and RAM patterns in one convenient repair accessory.
Its 0.12MM thickness is specified for compatible BGA solder ball applications, helping technicians select the appropriate reballing layout for different supported processor packages.
The stencil includes flagship Dimensity processor patterns alongside additional mid-range 5G chipset layouts, making it useful for professional mobile repair workshops.
With dedicated markings for seven processor packages and RAM496, the AMAOE U-MTU5 BGA Reballing Stencil provides flexibility for CPU servicing and compatible memory reballing.
Compatible MediaTek Dimensity Processors
Dimensity 9400 – MT6991Z
Listed CPU BGA reballing layout for compatible MediaTek Dimensity 9400 processor packages.
Dimensity 9300 – MT6989W
Supported processor pattern for compatible Dimensity 9300 CPU reballing applications.
Dimensity 9200 – MT6985W
Dedicated BGA layout for matching Dimensity 9200 processor packages.
Dimensity 6100+ – MT6835V
Listed MediaTek Dimensity 6100+ processor reballing pattern.
Dimensity 8300 Ultra – MT6897Z
Compatible CPU BGA layout for the listed Dimensity 8300 Ultra processor package.
Dimensity 7300X – MT6878V
Supported reballing pattern for matching Dimensity 7300X processor packages.
Dimensity 7200 Ultra – MT6886V
Listed CPU BGA pattern for compatible Dimensity 7200 Ultra applications.
Supported RAM Reballing Layout
RAM496: Dedicated 496-ball memory BGA reballing layout for compatible RAM packages.
Memory compatibility depends on the exact chip dimensions, ball arrangement and package specifications.
Professional Repair Applications
The AMAOE U-MTU5 BGA Reballing Stencil is intended for compatible MediaTek Dimensity processor reballing, RAM496 memory servicing and professional smartphone motherboard repair.
Technicians can identify the required stencil pattern using the exact CPU marking or memory package before carrying out BGA rework.
Different MediaTek processor generations may use different chip dimensions and ball patterns. Always match the physical component with its corresponding stencil layout.
Buy from ST Mobile Parts
Shop the AMAOE U-MTU5 BGA Reballing Stencil at ST Mobile Parts for professional MediaTek Dimensity CPU repair tools, RAM reballing accessories and mobile phone motherboard servicing equipment.
This multi-layout stencil offers a convenient solution for repair workshops handling supported flagship and mid-range MediaTek processor packages.
Note: Verify the exact CPU model, RAM package, chip dimensions, BGA ball count, pitch and stencil compatibility before purchasing or use. MT6991Z refers to the Dimensity 9400 layout in the verified U-MTU5 listings, not Dimensity 8400.
FAQs
What is the AMAOE U-MTU5 BGA Reballing Stencil used for?
It is designed for compatible MediaTek Dimensity CPU reballing, RAM496 memory rework and professional smartphone motherboard servicing.
What is the stencil thickness?
The specified thickness is 0.12MM.
Which MediaTek Dimensity processors are supported?
The listed processors include Dimensity 9400, 9300, 9200, 6100+, 8300 Ultra, 7300X and 7200 Ultra.
Does the AMAOE U-MTU5 support RAM reballing?
Yes. The stencil includes a dedicated RAM496 layout for compatible 496-ball memory packages.
Is this stencil compatible with every MediaTek Dimensity smartphone?
No. Compatibility depends on the exact processor or RAM package and matching BGA layout rather than the smartphone brand or chipset family alone.
Can the AMAOE U-MTU5 BGA Reballing Stencil be used for different Dimensity processor generations?
Yes, the AMAOE U-MTU5 BGA Reballing Stencil includes separate layouts for several listed MediaTek Dimensity processor generations. Select the correct pattern by matching the exact CPU marking and physical BGA package before reballing.
