AMAOE U-IP9 V7.0 iPhone 13 Stencil 0.12MM Apple iPhone 13 Mini 13 Pro 13 Pro Max A15 Bionic CPU Repair price in Pakistan

AMAOE U-IP9 V7.0 iPhone 13 Stencil

Brand: AMAOE

Model: U-IP9 V7.0 / U-IP9

Product Type: Apple iPhone CPU BGA Reballing Stencil

Thickness: 0.12MM

Application: Apple A15 Bionic CPU Reballing

Compatible Models: Apple iPhone 13, iPhone 13 Mini, iPhone 13 Pro, iPhone 13 Pro Max

Compatible Processor: Apple A15 Bionic

Supported CPU Layout: A15 Bionic

Stencil Version: V7.0

Reballing Type: CPU BGA Rework

Product Configuration: 1 × BGA Reballing Stencil

Designed For: iPhone 13 CPU reballing, iPhone 13 Mini processor repair, iPhone 13 Pro servicing, iPhone 13 Pro Max CPU repair, Apple A15 Bionic solder ball rework and professional smartphone motherboard servicing.

Compatibility Requirement: Exact CPU marking, processor package dimensions and physical BGA pattern must match.

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Description

AMAOE U-IP9 V7.0 iPhone 13 Stencil for Apple A15 Bionic CPU Repair

The AMAOE U-IP9 V7.0 iPhone 13 Stencil is a professional 0.12MM BGA reballing stencil designed for Apple A15 Bionic CPU and compatible IC repair applications.

It supports iPhone 13, iPhone 13 Mini, iPhone 13 Pro and iPhone 13 Pro Max processor servicing, chip-level rework and smartphone motherboard repair.

Why Choose This Stencil?

The AMAOE U-IP9 V7.0 iPhone 13 Stencil combines iPhone 13 series CPU reballing applications in one convenient professional repair tool.

Its 0.12MM thickness and precision BGA openings make it useful for compatible solder ball positioning and processor rework.

Compatible Models: Apple iPhone 13, iPhone 13 Mini, iPhone 13 Pro and iPhone 13 Pro Max.

Supported CPU: Apple A15 Bionic.

Compatible iPhone Models

The AMAOE U-IP9 V7.0 iPhone 13 Stencil is suitable for compatible Apple A15 Bionic processor reballing applications across the iPhone 13 series.

All four devices feature the A15 Bionic chipset. Exact CPU package dimensions and solder ball patterns must match before servicing.

Professional CPU Reballing

The AMAOE U-IP9 V7.0 iPhone 13 Stencil is useful for iPhone processor servicing, compatible BGA repair and professional smartphone motherboard rework.

It helps repair technicians position solder balls accurately when working with the corresponding CPU layout.

Buy from ST Mobile Parts

Shop the premium AMAOE U-IP9 V7.0 iPhone 13 Stencil at ST Mobile Parts, Karachi, Pakistan, for professional Apple CPU repair tools and BGA reballing accessories.

Note: Always verify the exact CPU marking, chip dimensions and physical BGA pattern before use.

FAQs

Does the AMAOE U-IP9 V7.0 iPhone 13 Stencil support iPhone 13?

Yes, Apple iPhone 13 with A15 Bionic is a listed compatible model.

Does it support iPhone 13 Mini?

Yes, iPhone 13 Mini is included.

Can I use it for iPhone 13 Pro and Pro Max?

Yes, both models use the Apple A15 Bionic processor.

Does it support Apple A15 Bionic CPU reballing?

Yes, Apple A15 Bionic is the main supported processor.

What is the stencil thickness?

It is 0.12MM.

Can I use it for other iPhone models?

Only when the exact CPU package and BGA layout are confirmed compatible.

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