AMAOE U-IP7 V9.0 BGA Reballing Stencil

Brand: AMAOE

Model: U-IP7 V9.0 / U-IP7

Product Type: Apple iPhone CPU BGA Reballing Stencil

Thickness: 0.12MM

Application: Apple A13 Bionic CPU Reballing

Compatible Models: Apple iPhone 11, iPhone 11 Pro, iPhone 11 Pro Max

Compatible Processor: Apple A13 Bionic

Supported CPU Layout: A13 Bionic

Reballing Type: CPU BGA Rework

Product Configuration: 1 × BGA Reballing Stencil

Designed For: iPhone 11 CPU reballing, iPhone 11 Pro processor servicing, iPhone 11 Pro Max CPU repair, Apple A13 Bionic solder ball rework and professional smartphone motherboard repair.

Compatibility Requirement: Exact CPU marking, processor dimensions and physical BGA pattern must match.

Verification Note: U-IP7 A13 compatibility is catalog-supported. The exact V9.0 marking requires confirmation from the original stencil.

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Description

AMAOE U-IP7 V9.0 BGA Reballing Stencil for iPhone 11 A13 CPU Repair

The AMAOE U-IP7 V9.0 BGA Reballing Stencil is a professional 0.12MM stencil designed for Apple A13 Bionic CPU reballing applications in iPhone 11, iPhone 11 Pro and iPhone 11 Pro Max.

It provides a compatible processor layout for chip-level servicing, BGA solder ball positioning and professional smartphone motherboard repair.

Why Choose This Stencil?

The AMAOE U-IP7 V9.0 BGA Reballing Stencil combines iPhone 11 series CPU reballing compatibility in one convenient repair tool.

Its 0.12MM thickness and precision BGA openings make it useful for compatible Apple A13 processor rework and professional mobile servicing.

Compatible Models: Apple iPhone 11, iPhone 11 Pro and iPhone 11 Pro Max.

Supported CPU Layout: Apple A13 Bionic.

Compatible iPhone Models

The AMAOE U-IP7 V9.0 BGA Reballing Stencil is intended for compatible A13 Bionic CPU repair applications across the iPhone 11 series.

All three listed models use the Apple A13 Bionic processor. Technicians should confirm the exact chip dimensions and physical solder ball arrangement before use.

Professional CPU Reballing Applications

The AMAOE U-IP7 V9.0 BGA Reballing Stencil is useful for iPhone processor servicing, smartphone motherboard repair and compatible BGA solder ball rework.

It helps technicians position solder balls during supported chip-level electronics servicing when the stencil layout matches the CPU.

Buy from ST Mobile Parts

Shop the premium AMAOE U-IP7 V9.0 BGA Reballing Stencil at ST Mobile Parts, Karachi, Pakistan, for professional iPhone CPU repair tools and reballing accessories.

Note: Always verify the exact CPU marking, chip dimensions and BGA pattern before use.

FAQs

Does the AMAOE U-IP7 V9.0 BGA Reballing Stencil support iPhone 11?

Yes, iPhone 11 with Apple A13 Bionic is a listed compatibility reference.

Does it support iPhone 11 Pro?

Yes, iPhone 11 Pro is included.

Can I use it for iPhone 11 Pro Max?

Yes, iPhone 11 Pro Max also uses the Apple A13 Bionic processor.

Does it support Apple A13 Bionic CPU reballing?

Yes, the A13 Bionic processor is the main supported CPU reference.

What is the stencil thickness?

It is 0.12MM.

Will it work with every iPhone?

No, it is intended for compatible A13 Bionic CPU layouts, not every Apple processor.