Description
AMAOE SAM:19 BGA Reballing Stencil for Samsung Galaxy S23 & S24 Series
The AMAOE SAM:19 BGA Reballing Stencil is a professional 0.12MM stencil designed for Qualcomm Snapdragon 8 Gen 2 (SM8550), Snapdragon 8 Gen 3 (SM8650), RAM496 and compatible mobile IC reballing.
It supports matching Samsung Galaxy S23, S23 Ultra, S24 and S24 Ultra processor layouts, making it useful for professional motherboard servicing.
Why Choose This Stencil?
The AMAOE SAM:19 BGA Reballing Stencil includes multiple CPU, RAM and supporting IC layouts in one convenient tool.
Its 0.12MM thickness and dedicated BGA patterns make it suitable for compatible chip-level rework and professional smartphone repair.
Buy from ST Mobile Parts
Shop this premium AMAOE stencil at ST Mobile Parts for Samsung CPU reballing tools, IC repair accessories and mobile motherboard servicing.
Note: Check the processor number, IC marking and BGA layout before purchasing. Regional Samsung chipset variants may differ.
FAQs
Will this stencil work with my Samsung S23 or S24?
Yes, if your phone has a matching SM8550 or SM8650 processor layout.
Does it support both Snapdragon 8 Gen 2 and Gen 3?
Yes, both CPU layouts are listed.
Can I use it for RAM reballing?
Yes, it includes a RAM496 layout.
What is the stencil thickness?
It is 0.12MM.
Does it support other ICs besides the CPU?
Yes, multiple IC layouts are included. Match your IC number and BGA pattern before use.
Which additional IC layouts are included in the AMAOE SAM:19 BGA Reballing Stencil?
The AMAOE SAM:19 BGA Reballing Stencil includes multiple supporting IC and BGA layouts, such as MAX77705C, CPS4038, WCN7851, PM8550BH, QPM6810 and other listed markings. Always verify the exact IC marking and BGA pattern before use.
