Description
AMAOE QU:6 Stencil | Premium IC Reballing Stencil
The AMAOE QU:6 Stencil is designed for mobile technicians working with Qualcomm communication chips and baseband components. It uses 0.12mm superhard Japanese stainless steel, giving the stencil a strong and precise surface for detailed IC reballing work.
This stencil supports MDM9600, MDM6600, MDM8215, MDM9215M, MSM6260, MSM7227, MSM7627, MSM6246M, MSM8909, QSC6270, QSC1110, QSC1105, and WMSM7521.
The AMAOE QU:6 Stencil covers Qualcomm Snapdragon, MDM modem, MSM baseband, and QSC single-chip communication processor applications.
Get your AMAOE Stencil from Stmobileparts.com for IC reballing and mobile motherboard repair work.
FAQs
Which chips can I use with this stencil?
It supports the listed MDM, MSM, QSC, and WMSM chips.
What is the stencil thickness?
It has a 0.12mm thickness.
What material is it made from?
The stencil uses superhard Japanese stainless steel.
What platforms does it support?
It supports Qualcomm Snapdragon, MDM modems, MSM basebands, and QSC processors.
