Description
AMAOE QU:3 BGA Reballing Stencil for Qualcomm Snapdragon CPU Repair | Premium Quality
The AMAOE QU:3 BGA Reballing Stencil is a professional 0.12MM stencil designed for compatible Qualcomm Snapdragon CPU reballing and smartphone motherboard repair applications.
It includes multiple BGA patterns for processor servicing, chip-level electronics rework and accurate solder ball positioning during compatible mobile CPU repair.
Why Choose This Stencil?
The AMAOE QU:3 BGA Reballing Stencil combines eight Qualcomm processor layouts in one convenient repair tool.
Its 0.12MM thickness and precise BGA openings make it useful for compatible CPU solder ball rework and professional smartphone servicing.
Supported CPU Layouts: MSM7225A, MSM8928 A, MSM8928 B, MSM8940, SDM660, MSM8909, MSM8952 and MSM8612.
Compatible Qualcomm CPU Layouts
The AMAOE QU:3 BGA Reballing Stencil includes layouts for Snapdragon 660 (SDM660), Snapdragon 617 (MSM8952) and other compatible Qualcomm MSM-series processors.
These chipsets are used in different Android smartphones. Exact device compatibility depends on processor markings and physical BGA patterns.
Professional CPU Reballing Applications
The AMAOE QU:3 BGA Reballing Stencil is suitable for compatible Qualcomm CPU servicing, smartphone motherboard repair and professional chip-level BGA rework.
Its multiple processor patterns help technicians choose the appropriate layout for different supported CPU packages.
Buy from ST Mobile Parts
Shop the premium AMAOE QU:3 BGA Reballing Stencil at ST Mobile Parts, Karachi, Pakistan, for professional Qualcomm CPU repair tools and BGA reballing accessories.
Note: Always verify the exact CPU number, chip dimensions and BGA solder ball pattern before use.
FAQs
Does the AMAOE QU:3 BGA Reballing Stencil support Snapdragon 660?
Yes, the SDM660 layout is listed.
Does it support MSM8928 A and B?
Yes, both processor layouts are included.
Does it support MSM8940 and MSM8909?
Yes, both markings are listed.
Can I use it for Snapdragon 617?
Yes, the MSM8952 layout is included.
Does it include MSM7225A and MSM8612?
Yes, both Qualcomm CPU markings are listed.
What is the stencil thickness?
It is 0.12MM.
Will it work with every Qualcomm phone?
No, the exact CPU marking, dimensions and BGA layout must match.
