Description
Amaoe HU:3 Stencil | Best Huawei HiSilicon IC Reballing
The Amaoe HU:3 Stencil is made for technicians handling Huawei HiSilicon CPU and RAM reballing work. It has an exact 0.12mm thickness for optimal paste deposit height and uses laser-cut, high-hardness stainless steel that resists heat deformation. This makes it suitable for detailed motherboard repair tasks.
It supports Huawei HiSilicon HI6260 in V100A/B and V101 versions, along with HI3670 A/B and HI3680 A/B chipsets. The Amaoe HU:3 Stencil provides a practical solution for technicians working on compatible Huawei boards where precise IC placement and reballing are required.
Get the Amaoe HU:3 Stencil from Stmobileparts.com for Huawei HiSilicon CPU and RAM reballing work.
FAQs
Which chipsets does HU:3 support?
It supports HI6260, HI3670, and HI3680 chipsets.
What is the stencil thickness?
The thickness is exactly 0.12mm.
Is it suitable for CPU and RAM work?
Yes, it is designed for Huawei HiSilicon CPU and RAM reballing.
What material is used?
It uses laser–cut, high-hardness stainless steel.
