Description
AMAOE Google WiFi BGA Reballing Stencil | Premium Quality
The AMAOE GWIFI-1 Google WiFi BGA Reballing Stencil 0.12MM is designed for compatible Google Pixel WiFi IC reballing applications. Featuring a 0.12MM thickness and dedicated BGA layouts, this stencil is intended for chip-level motherboard repair, WiFi IC servicing and professional mobile phone electronics repair.
The stencil supports reballing applications involving IC markings SS8924041, SS9706025, WP1-2020-G1 and KM9226047, subject to matching chip dimensions and BGA layouts.
Why Choose This Stencil?
The AMAOE Google WiFi BGA Reballing Stencil provides dedicated reballing patterns for compatible WiFi and connectivity IC repair applications. Its 0.12MM thickness and multiple IC layouts make it a useful tool for mobile repair technicians performing WiFi chip reballing, BGA solder ball rework, motherboard servicing and chip-level electronics repair.
Buy from ST Mobile Parts
Shop the AMAOE GWIFI-1 Google WiFi BGA Reballing Stencil 0.12MM at ST Mobile Parts for professional mobile phone repair tools, WiFi IC reballing stencils and BGA repair accessories.
Compatibility Note: Verify the exact IC marking, chip dimensions, BGA layout and ball pitch before purchasing or use. Compatibility depends on matching the IC layout with the stencil and is not guaranteed for every Google Pixel or Google WiFi device.
FAQs
What is the AMAOE Google WiFi BGA Reballing Stencil used for?
It is designed for compatible WiFi IC reballing during mobile phone motherboard repair, wireless connectivity chip servicing and BGA rework.
What is the thickness of the AMAOE GWIFI-1 stencil?
The stencil has a stated thickness of 0.12MM.
Which IC numbers are supported?
The listed IC markings include SS8924041, SS9706025, WP1-2020-G1 and KM9226047. Confirm the physical layout before use.
Is this stencil suitable for Google Pixel WiFi IC repair?
It is intended for compatible WiFi IC reballing applications where the chip dimensions and BGA layout match the stencil.
Can this stencil be used for mobile motherboard repair?
Yes, it is intended for compatible WiFi IC reballing and chip-level motherboard repair.
Is this a Google Tensor CPU reballing stencil?
No. It is listed for specific WiFi IC reballing applications and should not be confused with Google Tensor CPU reballing stencils.
Is the AMAOE GWIFI-1 suitable for professional technicians?
It is intended for technicians performing compatible WiFi IC reballing, BGA solder ball rework and electronics motherboard servicing.
Which IC markings are supported by the AMAOE Google WiFi BGA Reballing Stencil?
The AMAOE Google WiFi BGA Reballing Stencil includes layouts for SS8924041, SS9706025, WP1-2020-G1, and KM9226047. Before reballing, verify the exact IC marking and BGA layout to ensure proper alignment and accurate solder ball placement.
