Description
AMAOE CAR:9 BGA Reballing Stencil for Automotive ECU Memory ICs | Premium Quality
The AMAOE CAR:9 BGA Reballing Stencil is designed for electronics repair technicians working with compatible automotive ECU DDR, RAM, and memory storage ICs. Its 0.15MM thickness supports BGA reballing applications by helping position solder balls according to the IC package layout.
This stencil features multiple BGA patterns, making it a useful tool for automotive electronics repair and memory chip reballing. Always check the IC package and stencil hole pattern to confirm compatibility before use.
Compatible BGA Layouts
BGA100, BGA200, BGA315, BGA178, BGA137, BGA64, BGA153, BGA63, and BGA24.
Key Features
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- 0.15MM specified stencil thickness.
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- Multiple BGA patterns for compatible IC packages.
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- Designed for automotive ECU memory IC reballing.
- Suitable for professional electronics repair workshops.
Usage Tips
Clean the stencil before use, align it carefully with the IC, and select suitable solder balls and reballing equipment. Verify the package layout before applying heat.
Why Buy from ST Mobile Parts?
ST Mobile Parts offers electronics repair accessories for technicians and repair workshops. The AMAOE CAR:9 stencil is a practical option for compatible automotive ECU memory IC reballing.
FAQS
What is the AMAOE CAR:9 stencil used for?
It is designed for reballing compatible automotive ECU DDR, RAM, and memory storage ICs.
What is its thickness?
The specified stencil thickness is 0.15MM.
Which BGA layouts does it support?
BGA100, BGA200, BGA315, BGA178, BGA137, BGA64, BGA153, BGA63, and BGA24.
Is it compatible with every automotive ECU memory chip?
No. Compatibility depends on the IC package and its BGA layout.
How can I check compatibility?
Compare the IC’s solder-ball layout with the stencil hole pattern before use.
Is it suitable for professional repair work?
Yes, it is intended for compatible BGA reballing applications when used with appropriate equipment and techniques.
