Description
AMAOE HW11 V4.0 BGA Reballing Stencil for Huawei Kirin 990 CPU Repair
The AMAOE HW11 V4.0 BGA Reballing Stencil is a professional 0.12MM stencil designed for compatible Huawei HiSilicon Kirin 990 CPU reballing and smartphone motherboard repair applications.
It features BGA layout references for Kirin 990 (HI3690) and is marketed for selected Huawei P40, Mate 30, Nova 6 and Honor V30 series devices.
Why Choose This Stencil?
The AMAOE HW11 V4.0 BGA Reballing Stencil provides a convenient solution for compatible Huawei processor servicing and professional chip-level repair.
Its 0.12MM thickness and precision BGA openings help technicians position solder balls during matching CPU rework applications.
Supported CPU References: Kirin 990 (HI3690) and Kirin 990 5G (HI3690 5G), with the 5G layout requiring confirmation on the original V4.0 stencil.
Compatible Huawei Models
The AMAOE HW11 V4.0 BGA Reballing Stencil is associated with Huawei P40, P40 Pro, Mate 30, Mate 30 Pro, Mate 30 RS, Nova 6, Honor V30 and Honor V30 Pro processor repair applications.
Actual compatibility depends on the chipset variant, CPU dimensions and physical BGA pattern.
Professional CPU Reballing Applications
The AMAOE HW11 V4.0 BGA Reballing Stencil is useful for compatible Kirin processor reballing, smartphone motherboard servicing and professional BGA solder ball rework.
Buy from ST Mobile Parts
Shop the premium AMAOE HW11 V4.0 BGA Reballing Stencil at ST Mobile Parts, Karachi, Pakistan, for Huawei CPU repair tools and professional reballing accessories.
Note: Always verify the exact processor marking, package dimensions and physical BGA layout before use.
FAQs
Does the AMAOE HW11 V4.0 BGA Reballing Stencil support Kirin 990?
HI3690 is a published HW11 processor layout reference.
Does it support Huawei P40 and P40 Pro?
Both devices are included in HW11 series compatibility references.
Can I use it for Huawei Mate 30 and Mate 30 Pro?
Yes, these models are listed for compatible Kirin 990 processor applications.
Does it support Honor V30 and V30 Pro?
Both are supplied model references. Verify the exact processor layout.
Does it support Kirin 990 5G?
The supplied product references include HI3690 5G, but its presence on the exact HW11 V4.0 stencil must be confirmed.
What is the stencil thickness?
The stated thickness is 0.12MM.
Will it work with every Huawei phone?
No, the processor code, dimensions and BGA pattern must match.
