Description
AMAOE MI:17 BGA Reballing Stencil for Xiaomi Redmi & POCO
The AMAOE MI:17 BGA Reballing Stencil is a 0.12MM multi-layout tool for compatible MediaTek Dimensity CPU, RAM and supporting IC rework on selected Xiaomi Redmi and POCO motherboards.
Its main CPU markings are MT6833V, MT6877V, MT6891Z and MT6893Z, with supplier-listed Dimensity 700, 810, 920, 1080, 1100 and 1200 series applications.
Why Choose This Stencil?
The AMAOE MI:17 BGA Reballing Stencil brings several matching BGA patterns together on one plate for professional solder-ball rework.
Additional Layouts: RAM556, MT6315GP, VC7920-11, 77048E, 59080/58090, MT6190W, MT6359/6365, MT6190MV, 9902-11, VC7643, 8258-21, 429, BGA153, MT6360, 53730-11, BQ25980 and MT6635XP.
Buy from ST Mobile Parts
Available at ST Mobile Parts for compatible Xiaomi and POCO chip-level repair.
Note: Listed Redmi Note and POCO series contain different regional and 4G/5G processors. Always match the exact CPU or IC marking, package size and BGA layout.
FAQs
Will this work on my Redmi Note 10 Pro?
Only if your variant has a matching MediaTek chip; the common 4G model uses Snapdragon.
Does it support POCO M4 Pro 5G?
Yes, the Dimensity 810 family is listed. Confirm the chip pattern.
Can I use it for RAM?
Yes, RAM556 is listed.
Does it include other IC layouts?
Yes, multiple supporting IC patterns are included.
What thickness is it?
0.12MM.
Which MediaTek processors are supported by the AMAOE MI:17 BGA Reballing Stencil?
The AMAOE MI:17 BGA Reballing Stencil supports listed MediaTek Dimensity CPU layouts MT6833V, MT6877V, MT6891Z, and MT6893Z, along with RAM556 and compatible supporting IC layouts. Always verify the exact chipset marking and BGA pattern before use.
