Description
AMAOE SAM:18 V2.0 Stencil for Samsung Galaxy A14 & A54
The AMAOE SAM:18 V2.0 BGA Reballing Stencil is a professional CPU and IC reballing tool for compatible Samsung Galaxy A14 5G and Galaxy A54 5G motherboards.
It includes Samsung Exynos 1330 (E8535P), Exynos 1380 (E8835P) and additional supporting IC layouts.
Why Choose This Stencil?
The AMAOE SAM:18 V2.0 BGA Reballing Stencil combines multiple BGA patterns in one plate, making it useful for professional chip-level repair and solder ball rework.
Listed IC Markings: BGA254, 58083-11, 77098B, SPU15/Q, SN3U6P23, SK8K7320, SPU16, 180085, S620, 40365, SPA05, QPA4580, 110228, SM5714, S6566, 38P2C, 8267/78078 and QDM3525.
Buy from ST Mobile Parts
Get professional Samsung Exynos reballing tools from ST Mobile Parts.
Note: Confirm your exact CPU, BGA layout and stencil thickness before ordering.
FAQs
Will this work with my Samsung A14 5G?
Yes, if your phone uses Exynos 1330 and the matching BGA layout.
Can I use it for Samsung A54 5G?
Yes, the Exynos 1380 layout is included.
Does it support both E8535P and E8835P?
Yes, both CPU markings are listed.
Can I reball other ICs with it?
Yes, if their markings and BGA patterns match.
Is this the V2.0 version?
Yes, this listing is for SAM:18 V2.0. Confirm the thickness on the actual product.
Which processors are supported by the AMAOE SAM:18 V2.0 BGA Reballing Stencil?
The AMAOE SAM:18 V2.0 BGA Reballing Stencil supports the listed Samsung Exynos 1330 (E8535P) and Exynos 1380 (E8835P) CPU layouts, along with compatible supporting IC layouts. Confirm the stencil thickness (0.10MM or 0.12MM) and exact BGA pattern before use.
