Description
AMAOE LG:3 V1.0 BGA Reballing Stencil for LG V30 Series
The AMAOE LG:3 V1.0 BGA Reballing Stencil is a professional 0.12MM stencil designed for compatible LG V30 series CPU and IC reballing applications.
It supports Qualcomm Snapdragon 835 (MSM8998) processor layouts found in LG V30, V30 Plus, V30S ThinQ and V30S+ ThinQ smartphones.
Why Choose This Stencil?
The AMAOE LG:3 V1.0 BGA Reballing Stencil provides dedicated MSM8998 reballing patterns for professional smartphone motherboard servicing.
Its 0.12MM thickness makes it suitable for matching CPU solder ball rework and compatible chip-level repair.
Supported Models: LG V30, V30+, V30S, V30S ThinQ, V30S+ ThinQ and H930DS.
Buy from ST Mobile Parts
Shop this premium AMAOE stencil at ST Mobile Parts for LG smartphone CPU repair and BGA reballing tools.
Note: Confirm the exact CPU marking, IC dimensions and BGA pattern before purchasing.
FAQs
Will this stencil work with my LG V30?
Yes, it supports the Snapdragon 835 MSM8998 layout.
Can I use it for LG V30 Plus?
Yes, LG V30+ is included.
Does it support LG V30S ThinQ?
Yes, the V30S and V30S+ series are listed.
Can I use it for other ICs too?
Only if the IC package matches a pattern on the stencil.
What is the stencil thickness?
It is 0.12MM.
