Description
AMAOE EMMC:3 V2.0 Reballing Stencil for eMMC, UFS, NAND & Memory ICs
The AMAOE EMMC:3 V2.0 Reballing Stencil is a professional 0.15MM universal memory IC stencil designed for compatible eMMC, eMCP, UFS, UMCP, LPDDR, NAND and PCIe BGA reballing applications.
Featuring 12 BGA layouts, this stencil is suitable for smartphone memory chip servicing, storage IC rework and professional motherboard repair.
Why Choose This Stencil?
The AMAOE EMMC:3 V2.0 Reballing Stencil provides multiple memory IC patterns in one convenient tool.
Its 0.15MM thickness and dedicated BGA layouts make it useful for compatible solder ball rework and chip-level electronics servicing.
Supported BGA Layouts: BGA162, BGA153, BGA169, BGA221, BGA315, BGA297, BGA254, BGA178, BGA200, BGA110, BGA60 and BGA70.
Buy from ST Mobile Parts
Shop the AMAOE EMMC:3 V2.0 Reballing Stencil at ST Mobile Parts for professional memory IC repair tools and BGA reballing accessories.
Note: Verify the exact IC package, BGA layout and ball pitch before purchasing. Universal compatibility does not mean every memory chip is supported.
FAQs
Can I use this stencil for eMMC and UFS chips?
Yes, if your chip matches one of the supported BGA layouts.
Does it support NAND and LPDDR memory?
Yes, compatible NAND and LPDDR layouts are included.
How many BGA layouts does it have?
It includes 12 different BGA layout types.
What is the stencil thickness?
It is 0.15MM.
Can I use it for different phone brands?
Yes, as long as the memory IC package and BGA pattern match.
