Description
AMAOE U-MTK4 BGA Reballing Stencil for MediaTek Helio CPU & IC | Premium Quality
The AMAOE U-MTK4 BGA Reballing Stencil is a professional 0.12MM multi-layout tool designed for compatible MediaTek Helio CPU packages and selected power, RF and connectivity ICs. Its separate BGA patterns are intended for processor reballing, component repair and professional smartphone motherboard servicing.
This universal-series stencil is listed for Helio A22, P22, P40, P65, G80, P60 and P90 families, with exact compatibility determined by the printed IC marking and matching solder ball pattern. It is not a guarantee of support for every device using these processor names.
Why Choose This Stencil?
The AMAOE U-MTK4 BGA Reballing Stencil puts several processor and supporting IC footprints on a single plate, making layout selection easier when a workshop services different MediaTek chip packages.
The specified 0.12MM thickness is intended for matching reballing requirements. Each footprint must be checked against the chip dimensions, ball count and pitch before use.
Unlike CPU-only stencils, this product also lists power-management, RF and connectivity markings. Technicians can use the printed identifiers to choose an appropriate pattern instead of relying only on a phone brand or chipset series.
The AMAOE U-MTK4 BGA Reballing Stencil is suitable for professional BGA servicing where the chip and stencil layout have been independently matched.
Compatible MediaTek Helio Processor Layouts
Helio A22 — MT6761 / MT6761V: Listed processor-family reference.
Helio P22 — MT6762 / MT6762V: Matching CPU package must be confirmed.
Helio P40: Referenced in the stencil’s Helio family listing; verify its actual IC code and BGA pattern before use.
Helio P65 / G80 — MT6768 / MT6768V: Listed CPU-family layouts; exact variant and package must match.
MT6769V: A separately listed MediaTek processor marking; do not substitute another CPU solely by its commercial name.
Helio P60 — MT6771V: Listed CPU layout, subject to package verification.
Helio P90 — MT6779V: Listed CPU layout, subject to package verification.
MT6765V: Additional listed MediaTek processor footprint.
Additional Power, RF & Connectivity IC Markings
Power-related markings include MT6368W, MT6358VW, MT6357CRV, MT6359P and MT6360P.
Other supporting markings include MT6186W, MT6177W, MT6177MV and MT6631N.
Further printed reference patterns include BGA254, BGA221, 77645-21, 56022, 77912 and 77916.
Marking Check: Some catalogs shorten MT6761V, MT6762V and MT6768V to MT6761, MT6762 and MT6768. The supplied MT6358W differs from the MT6358VW spelling in the consulted supplier listings. Confirm the exact letters on the physical stencil before stating chip compatibility.
Because the stencil contains different component footprints, compare both printed identification and the physical ball arrangement with the chip being serviced. A similar chipset name does not necessarily mean the same package, solder pattern or application.
Buy from ST Mobile Parts
Shop the AMAOE U-MTK4 BGA Reballing Stencil at ST Mobile Parts for MediaTek Helio reballing tools and compatible power or connectivity IC servicing accessories.
This multi-pattern stencil can help technicians keep relevant processor and supporting IC layouts available for component-level BGA rework.
Note: Confirm the exact IC marking, chip package dimensions, solder ball pitch and physical hole alignment before purchase or use. Universal refers to several listed patterns, not all MediaTek chips.
FAQs
What is the AMAOE U-MTK4 BGA Reballing Stencil used for?
It is intended for reballing compatible MediaTek Helio CPUs and selected supporting power, RF and connectivity IC packages during motherboard servicing.
What is the stencil thickness?
The listed thickness is 0.12MM.
Which Helio processors are listed?
Supplier references cover Helio A22, P22, P40, P65, G80, P60 and P90 series. Confirm the exact processor code and package pattern.
Which additional IC layouts are listed?
Examples include MT6368W, MT6358VW, MT6357CRV, MT6359P, MT6186W, MT6177W, MT6631N, BGA254 and BGA221.
Is every MediaTek-powered phone compatible?
No. The AMAOE U-MTK4 BGA Reballing Stencil requires a matching IC package and BGA footprint. Phone branding alone cannot establish compatibility.
Can the AMAOE U-MTK4 BGA Reballing Stencil be used for both CPU and supporting IC rework?
Yes, the AMAOE U-MTK4 BGA Reballing Stencil includes separate listed layouts for compatible MediaTek Helio processors and selected power, RF and connectivity ICs. Always match the printed stencil pattern to the exact chip package before reballing.
