Description
AMAOE QU:2 Stencil | Premium Qualcomm IC Reballing Tool
The AMAOE QU:2 Stencil is made for technicians handling Qualcomm processor IC reballing on compatible smartphones. It uses 0.12mm Japanese steel with a high-grade stainless steel material, making it suitable for detailed motherboard repair work.
This stencil supports MSM8953, MSM8937, MSM8998, MSM8916, and SDM660 Qualcomm processors. It fits Xiaomi Redmi Note 4/5, Samsung S8, OnePlus 5, and Google Pixel 2. The AMAOE QU:2 Stencil gives repair technicians a practical option when working on these specific processor layouts and compatible mobile boards.
Choose AMAOE QU:2 Stencil from Stmobileparts.com for reliable Qualcomm processor reballing and compatible smartphone motherboard repair.
FAQs
Which processors does the QU:2 support?
It supports MSM8953,MSM8937, MSM8998, MSM8916, and SDM660.
Which phones are compatible?
It fits Xiaomi Redmi Note 4/5, Samsung S8, OnePlus 5, and Google Pixel 2.
What is the thickness?
The stencil is 0.12mm thick.
What material does it use?
It uses high-grade stainless steel with Japanese steel construction.
